In collaboration with Midea, NXP Semiconductors has unveiled a smart kitchen appliance using semiconductor microwave heating technologies. Combined with NXP innovative RF cooking components and Midea’s heritage of creating a more comfortable lifestyle for people, the new appliance delivers a balance of quality, precision and performance.
With the appliance, consumers can enjoy perfectly heated food within minutes.
The secret to efficient and effective heating, delivered by the Midea appliance, is NXP’s MHT1004N, a low-voltage solid state cooking transistor which creates and delivers energy in an effective and efficient way. The component enables greater control over the heating process and allows the Midea appliance to control energy in a closed loop manner for evenly heated food. The semiconductor cooking method also enables consistent results thereby enabling smart features for internet-connected appliances.
“We’re excited to team up with NXP and transform the conventional methods of cooking to solid state,” said Luan Chun, Director of the appliances business unit innovation centre at Midea. “Together, we’ve also jointly developed a standard system unit, which enables us to quickly implement new designs using a flexible, modular approach for future product developments.”
"Midea and NXP have been cooperating for years to research and develop solutions for the future smart kitchen,” said Mr. Wu Dong Senior Director of RF products at NXP Semiconductors Asia Pacific. “This new appliance calls upon our years of collaborating and innovating together with the same vision -- to usher in a smarter cooking experience into consumers’ kitchens.”
The new product from Midea is based on the MHT1004N, the latest generation cooking component from NXP. The MHT1004N is specifically developed as a 300W cooking device.
The new kitchen appliance will be demonstrated at IFA 2016 in Berlin, Germany in Midea’s booth, Hall 7.1a/101.