Based on the company's GP651 communication chip that can support various ZigBee and IEEE 802.15.4 communication protocols, GreenPeak Technologies has launched a low-cost ambient lighting application. GreenPeak's wireless LED lighting solution can combine LED lights with smart ambient applications, giving residents the creative freedom to create lighting scenes that match mood and function.
The solution supports 1- , 2- or 4-channel LED bulbs, allowing bulb manufacturers to build products which will give residents the ability to dim a bright LED bulb into warm white or to create a more vivid colourful scene. Settings and time schedules can be controlled by a smart home system, a smartphone or even a basic wireless switch.
Controlling your home with a wireless LED lighting solution makes it smarter, more secure, more comfortable and even more fun. Lights can intensify gradually when waking up or can gracefully dim in the evenings. Light can be bright at the dining table when working from home and can be switched to a more relaxed and cozy atmosphere during dinner. The wireless LED Lighting solution will help support the body’s biorhythm and help to focus on work, study and reading. For security, while on vacation, the system can switch lights on and off, giving the impression of residents being home while nobody is there.
Cees Links, Founder and CEO, GreenPeak Technologies, commented: “The GP651 chip enables the support of multiple protocols making it a future-proof and protocol-agnostic solution. GreenPeak’s wireless LED Lighting solution will seamlessly fit existing smart home systems, originating from different sources. The GP651 silicon, in combination with our partner’s LED driver that controls the power, will allow the LED light bulb manufacturers to produce light bulbs at very low cost, which will move the controlled LED lighting market into a new era of mass adoption.”
The GP651 is a low-cost, small footprint (QFN32), single chip solution. Additional cost savings can be achieved because of its +125°C (+257°F) spec, reducing the size of a heat sink, enabling a compact and creative product design and reducing the complexity of manufacturing resulting in a low total BOM.