The launch and implementation of China’s first ever large-scale road test initiative for intelligent connected vehicles through the NXP-Tongji University Joint Lab is to be supported by NXP Semiconductors and Tongji University.

The portfolio of plug-and-play (Near Field Communication) NFC solutions available from NXP has been extended with Arduino add-on boards and the release of the PN7150 NFC controller. This enhanced portfolio aims to make the integration of NFC technology in consumer electronic devices (especially in OS-based systems), easier and faster.

  Columbus to use NXP solutions, including real-time vehicle-to-vehicle and vehicle-to-infrastructure communication systems and secure public transportation smart cards for a more intelligent urban transportation system.

The industry’s first ARM Cortex-based system solution will extend virtualisation beyond the data centre, throughout the network and all the way to end user premises equipment and appliances with a single compatible software/silicon platform. Introduced by NXP Semiconductors N.V., the NXP QorIQ NFV platform signals a new era of network efficiency, security and service agility.

NXP Semiconductors N.V. has collaborated with leading Original Design Manufacturer (ODM) Accton Technology Corporation to develop a network services switch solution which is the first to combine the extreme 64-bit performance of ARM Cortex-A72 technology within a proven ODM design and in a comprehensive, open standards-based software platform.

PLI (Plasticard-Locktech International), the world's largest manufacturer of hotel keycards, has signed a large-scale and long-term supply agreement with Smartrac, featuring NXP MIFARE ICs. For Smartrac, the agreement means a breakthrough in the global hospitality, leisure and entertainment market, while PLI and its customers will benefit from a quantum leap in product capability, quality and security.

NXP Semiconductors has introduced what it claims to be the industry’s largest portfolio of broadband 28V LDMOS two-stage, dual-path Doherty-optimised ICs for small cell base stations. The LDMOS ICs are designed to provide RF power, efficiency and gain in all current and proposed frequency bands, from 700 to 3,800MHz, with RF output power of 2.5 to 12W.

NXP Semiconductors has announced an expansion to its portfolio of 48V GaN RF power transistors optimised for Doherty power amplifiers for use in current and next-gen cellular base stations. The four new transistors collectively cover cellular bands from 1,805 to 3,600MHz, meeting the needs of wireless carriers for superior performance at higher frequencies.

Expanding its portfolio of broadband GaN RF power transistors for electronic warfare and battlefield radio applications, NXP Semiconductors has announced six driver or final-stage amplifiers that have frequency coverage as broad as 1 to 3,000MHz.

  A line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK) has been introduced by NXP Semiconductors.

NXP Semiconductors N.V., a partner of the U.S. Department of Transportation’s (USDOT) Smart City Challenge, Siemens, and Cohda Wireless are demonstrating cutting edge technology for smart mobility this week in Austin, Texas, during NXP’s FTF Technology Forum. NXP and Siemens are hosting test rides in the smart city of Austin for a live experience of advanced connected mobility technologies, such as vehicle-to-vehicle (V2V) and vehicle...

NXP Semiconductors has expanded its best-in-class, low power and long range JN5169 wireless modules. The three wireless modules: JN5169_M00, JN5169_M05 and JN5169_M06, are pre-certified FCC/CE/IC and can be loaded with the latest NXP ZigBee 3.0 stack. The wireless modules with ZigBee 3.0 helps enable customers to rapidly introduce wireless products into the mass market faster. 

NXP Semiconductors and Wayv have unveiled the world’s first battery operated, handheld portable cooking appliance, the Wayv Adventurer. Designed to be compact, rugged and light-weight, the Wayv Adventurer is intended to give people the flexibility to efficiently and conveniently heat food anytime and anywhere.

In readiness for the next revolution in high speed home and small-business (SMB) broadband, NXP Semiconductors has introduced an expanded gateway platform scaling from 1Gbps at extreme low power, all the way to 20Gbps of bi-directional wireline/WiFi performance at the high end.

NXP Semiconductors has announced new solid state RF cooking modules to accompany its popular RF cooking components portfolio. The module is designed to help engineers rapidly build innovative RF cooking appliances that can achieve a better way of highly efficient, uniform heating, adaptability and consistency of the cooking process than conventional radiant or convection methods.

At NXP Semiconductor’s annual user conference, NXP FTF 2016, the company is showcasing new solutions to help engineers and developers create secure, smart, connected experiences. A key theme for the event is the future smart city, which presents a complex, multi-vertical opportunity for the IoT that crosses public and private sectors.

NXP Semiconductors expands its support for the electronic payments market by introducing a point-of-sale (POS) reader solution platform, SLN-POS-RDR, to enable customers to quickly develop and launch secure, contact and contactless payment systems into the market. The rapidly evolving market of electronic payments introduces new, innovative form factors, use cases and integration levels for the latest payment devices.

NXP Semiconductors has announced four new laterally diffused metal oxide semiconductor (LDMOS) RF power transistors that allow designers of solid-state cooking solutions to customise their products in both frequency and RF output power. They were designed exclusively to be used in cooking appliances and are incorporated within NXP's new solid-state RF cooking module.

NXP Semiconductors has introduced an innovative vertical integration technology called V-Link and will be demonstrating at the NXP Technology Forum the first product in the line-up which is based on the i.MX 6SoloX single chip module (SCM). The V-Link bus allows customers to customise their own system adding connectivity, sensing, and other innovative off-the-shelf solutions on top of the base SCM device through package-on-package assembly techno...

NXP Semiconductors has debuted the potential of secure, vivid and interactive interfaces powered by next gen i.MX 8 applications processors. NXP also introduced a multisensory enablement kit (MEK) based on i.MX 8, a multisensory processor family that promises to transform everyday interactions by advancing multimedia and display interfaces across demanding compute and media-intensive applications.