Telink Semiconductor has announced that its ZigBee RF SoC has passed the ZigBee compliant platform tests based on the latest ZigBee stack specification using DSR Corporation’s ZBOSS 3.0 ZigBee 3.0 wireless stack, and thus can start to provide a ZigBee 3.0 SDK to its customers.
The ZigBee 3.0 compliant platforms certification ensures that the ZigBee solutions (TLSR8646 and TLSR8626) offered by Telink Semiconductor conform to the latest ZigBee Alliance requirements, providing seamless interoperability among the widest range of smart devices and gives consumers and businesses access to innovative products and services that will work together seamlessly to enhance everyday life. This includes applications such as home automation, lighting, energy management, smart appliance, security, sensors, and health care monitoring products.
Telink Semiconductor worked with its strategic partner, DSR, to pass the latest ZigBee compliant platform certification based on DSR’s ZigBee 3.0 wireless stack – ZBOSS 3.0. The latter is a portable, high-performance ZigBee 3.0 software protocol stack allowing all device roles and featuring extensive support for various cluster libraries, predictable memory budgeting and optimised power consumption.
ZigBee 3.0 simplifies the choice for developers creating IoT products and services. It delivers all the features of ZigBee while unifying the ZigBee application standards found in tens of millions of devices delivering benefits to consumers today.
ZigBee 3.0 standard enables communication and interoperability among devices for smart homes, connected lighting, and other markets, which means more diverse, fully interoperable solutions can be delivered by product developers and service providers.
Telink Semiconductor provides customers with a full set of development tools for ZigBee applications, including reference schematics and layouts, integrated SDK, tool chains, reference application source codes.
For customers looking to develop new ZigBee 3.0 applications, the ZBOSS stack will also be included as part of the Telink Semiconductor SoC offering. This complete package will enable faster time to market and ease of new product rollout.