TI introduces affordable, sub-1 GHz wireless connectivity for ultra-low-power MSP430 LaunchPad development kit

2nd December 2011
Posted By : ES Admin
TI introduces affordable, sub-1 GHz wireless connectivity for ultra-low-power MSP430 LaunchPad development kit
Texas Instruments Incorporated has announced a sub-1 GHz radio frequency (RF) value line plug-in-board for TI’s MSP430™ microcontroller LaunchPad development kit. The new 430BOOST-CC110L RF BoosterPack includes ETSI-compliant and FCC-certified modules to help speed development time, reduce certification costs and eliminate barriers associated with the RF hardware design process.
The RF BoosterPack and MSP430 LaunchPad offer developers affordable solutions for cost-sensitive sub-1 GHz RF applications such as remote controls, toys, home and building automation, and security systems. The 430BOOST-CC110L is available today for $19, and the MSP430 LaunchPad is separately available for $4.30. For more information, see www.ti.com/rfboosterpack-preu.

“We are excited to bring wireless connectivity to the more than 100,000 MSP430 LaunchPads in the market today, and provide a simple, cost-effective development platform for those looking to innovate wireless products with MSP430 microcontrollers,” said Erling Simensen, product marketing manager, Low-Power RF, TI. “By combining TI’s leading ultra-low-power MSP430 microcontrollers with our sub-1 GHz RF value line transceivers, we are delivering easy-to-use, affordable and scalable solutions to wirelessly connect more cost-sensitive consumer applications.”

Additionally, the RF module included on the RF BoosterPack is separately available as an ETSI-compliant and FCC-certified production-ready module. The A110LR09A RF module is available from TI third party developer Anaren, Inc., and can be tested using the 430BOOST-CC110L development tool.

Key features and benefits: TI’s sub-1 GHz RF BoosterPack
• Easily add sub-1 GHz wireless connectivity to MSP430 LaunchPad (MSP-EXP430G2)
o RF BoosterPack contains two plug-in-boards with RF modules integrating TI’s CC110L sub-1 GHz RF value line transceiver, passive components and compact PCB antenna
o CD with software and documentation
o Easy to use wireless software stack (AIR BoosterStack from Anaren) makes it easy for developers to add RF to any system
• Reduce development costs
o Sub-$30 total cost for complete RF BoosterPack development environment: One 430BOOST-CC110L RF BoosterPack ($19) and two MSP430 LaunchPads ($4.30 each)
o ETSI-compliant and FCC-certified solution eliminates costly intentional radiator certification process
o No RF hardware design required, designer can add module as an embedded PCB component
o Free software development tools for writing, debugging and compiling code on MSP430 value line devices
• Leverage the products’ scalability
o Operation in the 868 and 915 MHz bands
o Programs developed on MSP430 LaunchPad can be migrated to higher-end MSP430 devices
o Production-ready CC110L-based A110LR09A module available separately from TI third party developer Anaren, Inc.

Tools, availability and pricing
The 430BOOST-CC110L sub-1 GHz RF value line BoosterPack is available today from TI and through authorized distributors for $19. The module included on the BoosterPack is available as a stand-alone product from Anaren through their authorized distributors. The MSP430 microcontroller value line LaunchPad development kit is available today for $4.30 from TI and authorized distributors.

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