The MRFE6VP5150 and MRFE6VP5300, plastic packaged power amplifiers designed for harsh environments, has been introduced by Freescale Semiconductor. These amplifiers are claimed to be the industry’s first devices to be housed in over molded plastic packaging with a VSWR rating of more than 65:1.
When compared to ceramic RF packages, plastic packaging features superior manufacturability and outstanding thermal impedance and significant cost benefits. With a VSWR rating of more than 65:1 and simultaneous over voltage and overdrive, Freescale Semiconductor combines this advantage with a ruggedness traditionally associated with ceramic-housed devices.
The power amplifiers facilitate high gain across a wide frequency range of 1.8-600MHz, thus requiring fewer parts and reducing design complexity. Due to the device's high energy efficiency, cooling is simplified, lowering operating expenses and shrinking form factors. Integrated stability enhancements and ESD protection circuitry are also incorporated into the amplifiers.
Suitable applications for the MRFE6VP5150 and MRFE6VP5300 include FM broadcast, CO2 lasers for medical applications and VHF and UHF base stations for public safety radio installations.
“Freescale has deployed millions of RF power transistors in plastic packages for macrocell base stations in the cellular market," said Paul Hart, Senior Vice President and General Manager for Freescale’s RF business. “We are now extending our RF power amplifier packaging expertise to industrial applications. The MRFE6VP5150 and MRFE6VP5300 devices are the first members of a plastic package product portfolio engineered for optimal ruggedness, and are an expansion of our highly successful MRFE6VP61K25 family.”