Design
3D hologram research could lead to improved IVF success
In a world first, 3D holographic images of an embryo have been developed as part of a collaborative research project between the University of St Andrews and University of Adelaide.
Semiconductors of the future using cutting edge transistors
The significance of transistors capable of altering their properties cannot be understated in the advancement of future semiconductors.
Smart graphene paper allows for rapid testing
Chih-Jen Shih and Andrew deMello, chemical engineers from ETH Zurich, have spearheaded a project to create a fast-testing system using advanced graphene paper.
DELO introduces structural adhesive for electric motors
DELO has developed its first dual-curing, high-temperature adhesive for electric motor applications.
Addressing three key space applications
Electronics intended for space missions face unique conditions and challenges – specialised integrated circuit (IC) packaging can help mitigate some of those challenges.
Robust fanless 5G digital signage player for demanding outdoor environments
IBASE Technology, a specialist provider of industrial computers and digital signage players, has released the SE-603-N outdoor digital signage player.
Cost-efficient InGaAs APDs
LASER COMPONENTS expands its range of InGaAs APDs (avalanche photodiodes) with its new IAL series.
OKI IDS adopts Siemens catapult synthesis platform
Siemens has announced that OKI IDS has adopted Siemens Catapult software for High-Level Synthesis (HLS) and High-Level Verification (HLV) in its design and verification services.
ZTE intelligent computing infrastructure at MWC Shanghai
ZTE has demonstrated a new type of intelligent computing infrastructure at the 10th MWC Shanghai.
TouchNetix expand aXiom product offering with BGA package
Building on its aXiom product family offering, TouchNetix announces the introduction of ball grid array packaging (BGA) for its largest aXiom chip, the AX198A.