Design

Displaying 11 - 20 of 467

Ultra-flexible blade solutions for SDN/NFV deployments

Ultra-flexible blade solutions for SDN/NFV deployments
5G networks are anticipated to revolutionise future networking capabilities with much enhanced performance, throughput, bandwidth and much shortened latency. Since the fundamental infrastructure of 5G lies in the distributed edge computing, Lanner is introducing next-generation networking hardware to empower the flexibility, agility, low-latency data processing and analytics at the edge to enable 5G applications for service providers.
13th May 2019

Ultra-low jitter clock for 400Gpbs links

Ultra-low jitter clock for 400Gpbs links
Featuring a bulk acoustic wave (BAW) resonator, the LMK05318 network synchronizer clock from Texas Instruments (TI) is in stock at Mouser Electronics. The ultra-low jitter single-channel clock for 400-gigabits-per-second (Gbps) links helps systems transmit more data faster while also providing higher margin for system jitter budgets than similar devices.
9th May 2019

IoT platforms enable faster connections

IoT platforms enable faster connections
Particle is a range of cloud-connected development kits from Farnell with mesh-enabled networking, making it possible to extend sensor mesh networks and get devices connected to the cloud, over Wi-Fi or Cellular networks, in minutes. The Particle IoT platforms offer everything needed to create a robust and securely connected IoT product, from device to cloud, with seamless transition from prototype to global deployment with Device Cloud hosted infrastructure.  
9th May 2019


802.11ax front end module offers high throughput

Design and sales support for an 802.11ax front end module (FEM) is being offered by distributor RFMW. The Qorvo QPF4206B optimises the power amplifier for 5V operation while maintaining linear output power and leading-edge throughput.
12th April 2019

Audio streaming optimised for gaming headset

Audio streaming optimised for gaming headset
The NXH3670 wireless gaming headphone solution from NXP Semiconductors is in stock at Mouser Electronics. The ultra-low-power single-chip device is a 2.4GHz wireless transceiver with an embedded microcontroller and a proprietary audio streaming protocol to create a solution for gaming headset applications.
8th April 2019

Certified TSS product reduces risk for avionics systems integration

Certified TSS product reduces risk for avionics systems integration
Specialist in edge computing, ADLINK Technology has announced support for both C++ and Java in its Vortex Data Distribution Service (DDS) product. Proven to provide reliable, real-time data sharing for mission critical systems, it has passed all the required tests for conformance certification to Edition 2.1.1 of the Future Airborne Capability Environment (FACE) Technical Standard. 
2nd April 2019

Ease IoT design with third-party platform development flows

Ease IoT design with third-party platform development flows
Taking another high-impact step towards accelerating developers ability to bring differentiated Internet of Things (IoT) products to market, Cypress Semiconductor has announced that its ModusToolbox suite will now provide support for complete device-to-cloud application development flows based on the industry’s most popular open-source IoT platforms.
13th March 2019

Mix-and-match wireless connectivity for developers

Mix-and-match wireless connectivity for developers
It has been announced that Murata is collaborating with Cypress Semiconductor and NXP Semiconductors to provide IoT developers with mix-and-match wireless connectivity and processing solutions that shorten the time-to-market cycle. The combined products pair Murata’s industry-leading wireless modules, based on Cypress’ robust WiFi and Bluetooth combos, with a broad range of best-in-class processors from the NXP i.MX series.
6th March 2019

Development kit addresses BLE IoT applications

Development kit addresses BLE IoT applications
The Bluetooth Low Energy (BLE) IoT Development Kit (B-IDK) from ON Semiconductor is available at RS Components. Based on a low-power Bluetooth Low Energy radio System-on-Chip (SoC), the modular platform is suited to developing IoT applications with extended battery life including smart appliances, asset trackers, wearables, and smart lighting.
5th March 2019

Single-chip adaptable radio platform for 5G wireless applications

Single-chip adaptable radio platform for 5G wireless applications
Xilinx announced it has extended its Zynq UltraScale+ radio frequency SoC portfolio with greater RF performance and scalability. Building on the multi-market success of the Zynq UltraScale+ RFSoC base portfolio, next-gen devices can cover the entire sub-6GHz spectrum, which is a critical need for next-gen 5G deployment. They support direct RF sampling of up to 5GS/S 14-bit Analogue-to-Digital Converters (ADCs) and 10GS/S 14-bit Digital-to-Analogue Converters (DACs), both up to 6GHz of analogue bandwidth.
27th February 2019


Design documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

IFSEC 2019
18th June 2019
United Kingdom EXCEL, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona