Laird Bluetooth modules feature innovative firmware

Posted By : Raj Joshi
Laird Bluetooth modules feature innovative firmware

Laird Technologies have today released a new series of Bluetooth modules, the BTM46x Series. Innovative firmware on the BTM46x series is based on the CSR BC04 chipset, allowing OEMs to support Bluetooth data connectivity for all PCs, smartphones and tablets including Apple iOS devices. Accelerating time to market, this firmware enables Apple licensees to leverage Bluetooth data connectivity, via the iAP protocol, into their MFI accessories.

Jonathan Kaye, Laird product manager, commented: “With Laird’s BTM46x modules and associated development kit, OEMs can provide cross platform Bluetooth data support in a simple and easy to use module. Laird’s embedded firmware provides a seamless data connectivity engine regardless of whether connecting to, or from, Bluetooth enabled Android, Windows, Linux or iOS devices.”

With every BTM46x module designed to add robust short-range Bluetooth data connectivity to any device, target applications for the new Bluetooth modules include medical devices, ePOS terminals, barcode scanners, industrial cable replacement, and smartphone/tablet ‘Appcessories’.

The new Bluetooth modules deliver maximum range in a compact footprint of just 12.5 x 22mm. Including a complete Bluetooth v2.1 protocol stack for increased ease of integration, the BTM46x Series are designed to support a separate power supply for I/O. Fully qualified as a Bluetooth End Product, the modules hold FCC Modular, IC, CE and MIC (Japan) regulatory approvals. This enables designers to integrate the modules into devices quickly and without the need for additional qualification resources. The BTM46x Series provides support for multi-point connections and includes Serial Port Profile, HID and Apple’s iAP protocol Bluetooth profiles.

Mass production quantities of the BTM46x modules and associated development kits are available now, directly from Laird. The low-cost development kit enables OEMs to easily integrate the module and guarantees the fastest route to prototype and then mass production.


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