Laird Technologies announced today that it will demonstrate its Thermobility Wireless Power Generator series at Energy Harvesting & Storage Europe. The event will be held at the International Congress Centrum ICC Berlin in Berlin, Germany, April 17-18, 2013. Laird Technologies will exhibit at booths P7 and P8.

Laird Technologies announce today that its’ advanced, first-to-market, high-speed wireless antenna system has been deployed at the Singapore Changi Airport, the 15th busiest airport in the world. Laird’s CMD69273 Dual Port MIMO antenna system provides better wireless coverage for mobile data connections, and increases speed for faster mobile downloads for the more than 50 million passengers who travel through the airport each year, according ...

Laird Technologies today announced it will demonstrate a new reference design for a compact PCR thermal cycler for field-level DNA amplification at Pittcon 2013. The event will be held at the Pennsylvania Convention Center in Philadelphia, Pennsylvania, March 17-21, 2013. Laird Technologies will exhibit at booth #3553.

Laird Technologies has revealed that it will attend IWCE 2013. The event will be held at the Las Vegas Convention Center, March 13-14, 2013. Laird Technologies will exhibit at booth #2213. Through innovation, reliable fulfillment and speed, Laird is a trusted partner and supplier for many of the world’s leading technology companies.

Laird Technologies has revealed that it will be attending SME 2013. The event will be held at the Colorado Convention Center in Denver, Colorado, February 24-27, 2013. Laird Technologies will exhibit at booth # 2042. Through innovation, reliable fulfillment and speed Laird is a trusted partner and supplier for many of the world’s leading technology companies.

Laird Technologies today announces the acquisition of Nextreme Thermal Solutions. Nextreme’s innovative technology, delivering high precision cooling in an ultra-small form factor, will advance Laird’s leadership in its existing thermal management business.

Laird Technologies has today announced that it will be attending and presenting at SPIE Photonics West 2013. The event will be held at The Moscone Center in San Francisco, California, February 5-7, 2013. Laird Technologies will exhibit at booth #4642. In addition to exhibiting, Dr. Jeff Hershberger, Laird Technologies Staff Scientist and Technology Leader, will participate in a poster presentation session on Tuesday, February 5 from 6 p.m. to 8 p...

Laird Technologies has released Android 2.3 Gingerbread support for its Summit 40 Series radio modules, which support dual-band 802.11n (802.11a/b/g/n) and Bluetooth 2.1. “Business-critical mobile devices such as handheld mobile computers are beginning to run Android instead of Windows Embedded Handheld or Windows Embedded Compact,” said Laird Technologies Product Director Chris Bolinger.

Laird today announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird’s value proposition to deliver solutions for today’s smaller, more advanced electronics. As part of Laird Performance Materials (LPM), these products provide vital protection for a wide range of high-performance electronic devices.

Laird Technologies, Inc today announced it will host a suite at the 2013 International CES (Consumer Electronics Show). The event is being held at the Las Vegas Convention Center in Las Vegas, Nevada, January 8-11, 2013.

Laird Technologies today announced the publication of a white paper discussing radio frequency range, or the distance at which a wireless connection can operate. The white paper, “Understanding Range for RF Devices,” is an excellent tool for device makers that are embedding wireless radios.

Laird Technologies today announced the release of its new AA-250 Outdoor Cooler Series. The AA-250 Outdoor Cooler Series are ruggedized Air-to-Air thermoelectric assemblies that use impingement flow and custom designed thermoelectric modules to transfer heat. Designed for outdoor enclosures, this product line cools battery back-up systems that are susceptible to degradation when exposed to elevated temperatures or heats when exposed to very cold ...

Laird Technologies today announced the release of two new Tflex series thermal gap fillers. The Tflex SF800 and Tflex SF200 are the latest addition to Laird Technologies’ thermal gap filler line. The introduction of these two new products expands Laird Technologies’ silicone-free gap pad selection.

Laird Technologies has today announced the publication of its “Thin Film Thermoelectric Handbook.” The handbook was authored by the company’s thermal management subject matter experts. The handbook focuses on thin film thermoelectric modules and provides in-depth insight into the advantages of TFM’s over traditional bulk technology, as well as the basic structure and function of TFMs, system level considerations required for device select...

Laird Technologies has today announced the release of its new Thermobility Series Wireless Power Generator product line. The Thermobility Series are self-contained thin film thermoelectric power generators that harvest waste heat and convert it to usable output DC power.

Laird Technologies has today announced the release of its new eTEG Series Thin Film Energy Harvesting product line. The eTEG Series are thermoelectric power generators that harvest waste heat and convert it in to usable output DC power. Due to their micro scale size and higher output power density, these devices are especially suitable for use in wireless sensors, LED lighting and battery charging applications.

Laird have announced the launch of a new version of AZTEC, a thermoelectric module simulation software. AZTEC allows users to specify a given set of input variables based on application attributes and the program will select the optimal TEM(s) for trial.

Laird Technologies has today revealed that it will be attending electronica 2012. The event will be held at the New Munich Trade Fair Center in Munich, Germany, November 13-17, 2012. Laird Technologies will exhibit in both Hall A2, booth #163 and in Hall A4, booth # W15-W16.

Laird Technologies today announced it will be attending European Microwave Week in Amsterdam. The company will participate in the exhibition portion of the event October 29-31, 2012. Laird Technologies will exhibit at booth #225. Emerson & Cuming Microwave Products, a unit of Laird Technologies, will be displaying samples from their ECCOSORB microwave absorbers and ECCOSTOCK dielectric materials.

Laird Technologies today unveiled the release of its RM024 Range-Amplified MultiPoint (RAMP) wireless module. The RM024 RAMP module is backward compatible with the popular LT2510 module and also offers a new RF front end for improved sleep, an improved link budget, and a switchable antenna output.