MediaTek has announced the launch of the MediaTek Helio P10, a high-performance, high-value SoC focused on the growing demand for slim form-factor smart phones that provide premium, flagship features. The Helio P10 showcases a 2GHz, True Octa-core 64-bit Cortex-A53 CPU and a 700MHz, Dual-core 64-bit Mali-T860 GPU. The Helio P10 will be available Q3 2015 and in consumer products by late 2015.
The P10 is the first chip in the Helio P family, a series which aims to integrate into a high-value chipset, premium features such as high-performance modem technology; the world’s first TrueBright ISP engine for ultra-sensitive RWWB; and, MiraVision 2.0, for top-tier display experiences.
The features available in the P series include several of MediaTek’s premier technologies, such as WorldMode LTE Cat-6, supporting 2x20 carrier aggregation with 300/50Mb/s data speed; MediaTek’s advanced task scheduling algorithm, CorePilot, which optimises the P10’s heterogeneous computing architecture by sending workloads to the most suitable computing device – CPU, GPU, or both; and, MediaTek’s Visual Processing Application – Non-contact Heart Rate Monitoring, which uses only a smartphone’s video camera to take a heart rate reading and is as accurate as pulse oximeters/portable ECG monitoring devices.
The Helio P10 is the first product to use TSMC’s 28nm HPC+ process, which allows for reduced processor power consumption. With the help of the latest 28HPC+ process and numerous architecture and circuit design optimisations, the Helio P10 can save up to 30% more power (depending of usage scenarios), compared to existing smartphone SoCs manufactured using the 28 HPC process.
As with the entire line of Helio SoCs, the P10 is packed with premium multimedia features. With a concentration on advanced display technologies, premium camera features, and HiFi audio, the P10 delivers leading functionality around the features most used on today’s mobile phones.
A 21MP premium camera with the world’s first TrueBright ISP engine enables an ultra-sensitive RWWB sensor to capture twice as much light as traditional RGB sensors, in order to retain true colour and detail, even in low light. The RWWB sensor also enhances colour resolution, even when compared with RGBW sensors.
Other features include a de-noise/de-mosaic HW, PDAF, video iHDR, dual main camera, less than 200ms shot-to shot delay, and video face beautify. Hi-fidelity, hi-clarity audio achieves 110dB SNR & -95dB THD, and a full HD display at 60FPS boasts MediaTek’s suite of MiraVision 2.0 display technologies - UltraDimming, BluLight Defender and Adaptive Picture Quality.
“We are pleased to see MediaTek’s achievement in producing the world’s leading 28HPC+ smartphone chip,” said Dr. BJ Woo, Vice President, Business Development, TSMC. “As an enhanced version of TSMC’s 28HPC process, 28HPC+ promises 15% better speed at fixed power or 50% leakage reduction at the same speed over 28HPC. Through our competitive 28HPC+ technology and process-design collaboration with MediaTek, we believe MediaTek will deliver a series of products which benefit smartphone users across the world.”
“The P series will provide OEM smartphone makers with greater design flexibility to meet consumer demands for slim form-factors, which provide dynamic multimedia experiences,” said Jeffrey Ju, Senior Vice President of MediaTek. “The P10 enables state-of-the-art mobile computing and multimedia features all while balancing performance and battery life.”
The MediaTek Helio P10 will be released in Q3 2015 and is expected to be available in consumer products in late 2015.