Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, has introduced its SmartClik technology, a proof of concept for future buttonless smartphone designs. Using Boréas’ ultra-low-power piezoelectric driver integrated circuit, the BOS1901 - which provides high definition haptic feedback for the two piezo actuators next to the frame - SmartClik replaces the smartphone’s mechanical volume and power buttons, satisfying growing user demand for more sophisticated HD tactile feedback over staid push-button user interfaces.
“Even today’s highest-end smartphones have just one haptic engine that shakes the whole phone when you push a button. This rudimentary implementation gates designers’ ability to improve the phone’s user interface,” said Simon Chaput, founder and CEO, Boréas Technologies. “SmartClik, on the other hand, uses Boréas’ piezo chip technology to transform haptic-feedback design. Each ‘piezo button’ becomes a localised haptic engine that supports area-specific tactile effects. Because it is software-programmable, SmartClik gives UI designers more versatility. Designers can customise localised haptic feedback for different applications, making gameplay and taking photos feel more realistic.
“SmartClik technology is also highly power-efficient,” added Chaput. “It’s the first technology platform that meets the requirements of buttonless smartphones without draining the battery. It actually saves 10X power over competitive piezoelectric haptic feedback solutions while enabling true HD touch.”