AMC suits 4G, LTE & LTE Advanced applications

With other FPGA options available on request, the AMC-V7-2C6670 provides a high density XC7VX415T-2 Virtex-7 FPGA as standard and includes Serial RapidIO (SRIO), Gigabit Ethernet and PCI Express to give maximum I/O flexibility. Based on TI’s KeyStone multicore architecture, two TMS320C6670 fixed- and floating-point quad core DSPs from Texas Instruments are included in the AMC. With 8 DSP cores running at 1.2GHz and shared memory, the module delivers high DSP performance to meet the demands of wireless applications.

Flexible, high-bandwidth off-board communications are enabled by an IDT CPS-1848 Gen2 SRIO switch, which also supports Serial RapidIO at up to 25Gbaud per port. Flexible high-speed optical links for a range of applications are provided by three front panel SFP+ optical interfaces which link to the FPGA or DSPs at up to 10.3Gbaud. A compact full-size, single width PICMG AMC.0 R2.0 AMC, the AMC module is suitable for use in both ATCA carriers and MicroTCA chassis. Additionally, it can operate as a standalone module, with suitable power and cooling.

In order to provide maximum flexibility and access to all main devices on the module, a Gigabit Ethernet interface uses on-board switches. Two fast 10Gbaud PCI Express links connect the FPGA with each of the two DSPs, and for applications that require timing and synchronisation, this is achieved via the front panel or backplane clock I/O, or an optional GPS receiver. Up to 2GB of 64-bit wide DDR3-1600 SDRAM is available for each DSP: the FPGA has two banks of DDR3 SDRAM, 1GB of 32-bit wide and 512MB of 16-bit wide memory,  and 256MB of Flash memory for non-volatile storage of multiple FPGA configurations and DSP and FPGA software.

Edward Young, Managing Director, CommAgility, comments: “With the Virtex-7, Xilinx has delivered the DSP performance and I/O bandwidth that’s required for high performance wireless baseband processing - while simultaneously reducing power consumption.”