Wireless
Silicon Labs and IMST collaborate to introduce a turnkey wireless M-Bus solution designed for the smart energy market.
The comprehensive hardware/software solution combines IMST’s industry-leading expertise in the wireless M-Bus market with Silicon Labs’ Si10xx wireless microcontroller (MCU) technology to simplify the deployment of ultra-low-power, high-performance, pre-certified wireless M-Bus modules for smart meters.
Digi Extends ConnectCore i.MX Product Family and Freescale Collaboration with new iDigi-Enabled Wireless Module
Digi International introduces the ConnectCore™ Wi-i.MX53, the second in a series of core processors based on the Freescale Semiconductor i.MX processor family. The new solutions-on-module enables wired and wireless networking of multimedia products requiring high-end processing power and high-definition video display capabilities. It can connect to the iDigi cloud out of the box, allowing customers to easily develop cloud-connected wireless mul...
Digi Wireless Design Division Extends Freescale Collaboration with Custom Design Support for Freescale i.MX53 Processor
Digi International has announced that Spectrum Design Solutions, Digi’s wireless design division, will offer custom design support for companies developing wireless products with Freescale Semiconductor’s advanced i.MX53 application processor.
DECT/CAT-IQ INSTEAD OF WIFI
DECT/CAT-iq modules and chipsets from the DSP Group are now available from CODICO. DECT or CAT-iq interfaces are now required in almost all new developments for the broadband router markets in both home and SoHo environments and, of course, also in CoIP gateways.
Aeroflex Demonstrates Support for P25 TDMA on the 3900 Series Digital Radio Test Set
Aeroflex Incorporated announced that it has successfully demonstrated the decoding and encoding of the Project 25 TDMA H-DQPSK (Harmonized Differential Quadrature Phase Shift Keying) radio signal using the 3900 Series Digital Radio Test Set.
Broadcom Announces Industry's Lowest Power Dual/Quad CDRs for High Density 10G Applications
Broadcom Corporation today announced the addition of three new 10GbE clock and data recovery (CDR) devices to its high-speed interconnect products (HSIP) portfolio that provide increased signal integrity while achieving the lowest power consumption in the industry. Broadcom will demonstrate these new CDR solutions for wired networking at this week's Optical Fiber Communication (OFC) Conference and Exposition, March 8-10, 2011 at the Los Angeles ...
Broadcom Announces Industry's First Quad 10GbE SFP+ PHY with MACsec
Broadcom Corporation today unveiled its latest 10 Gigabit Ethernet (10GbE) physical layer (PHY) transceiver that supports the IEEE 802.1AE media access controller (MAC) security standard (known as MACsec) — a specification designed to safeguard connectionless data security, integrity and confidentiality for independent MAC protocols traveling between PC users and network servers and printers.
SMD antennas for HF/NFC applications (2 - 13,56 MHz).
In the last few years, Communication technology by Near Field Communications (NFC) has experienced a lot of improvements. New Iphone5 has been announced with this NFC functionality for E-Wallet application.
Laird Technologies Releases New WPD136M6C-001 Multi-Band Mobile Antenna
Laird Technologies, Inc. today announced the release of its new WPD136M6C-001 full spectrum multi-band mobile antenna.
Laird Technologies Releases Enhanced HDDA5W HD Series™ High Performance Dish Antenna
Laird Technologies, Inc. today announced the release of its enhanced HDDA5W HD Series™ high performance dish antenna.