Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, has introduced its SmartClik technology, a proof of concept for future buttonless smartphone designs. Using Boréas’ ultra-low-power piezoelectric driver integrated circuit, the BOS1901 - which provides high definition haptic feedback for the two piezo actuators next to the frame - SmartClik replaces the smartphone’s mechanical volume and power buttons, satisfying growing user demand for more sophisticated HD tactile feedback over staid push-button user interfaces.