Spirent Hardware Pushes Carrier Network And Data Centre Testing Limits

20th May 2013
Posted By : ES Admin

Spirent Communications announce the launch of its next-generation high speed Ethernet test solutions. New high density test modules along with a high performance chassis enable doubling of port densities while lowering power consumption and total cost of ownership. Highlights of the new hardware include:

-Spirent dX2 offers the industry’s first 8-port 40GbE/32-port 10GbE dual-speed test module in a single slot configuration packing up to 96 ports of 40GbE onto a single chassis. The dX2 series combines both 40GbE and 10GbE functionality in several density and speed form-factors to provide the most flexible and cost-effective solution for testing high-performance low latency top of rack switches, end of row switches, and data centre fabrics spanning hundreds or thousands of ports.

-Spirent fX2 40/10GbE dual-speed test modules combine Spirent’s layer 2-7 traffic generation and analysis with scalable network emulation to deliver a perfect blend of enhanced realism, scalability and performance. The fX2 module supports up to five 40GbE and 20 10GbE ports per slot, making it ideal for functional, conformance and performance testing of service provider, data center, SDN, or cloud infrastructure environments.

-Spirent fX and Spirent mX 2-port single slot 100GbE test modules now support CFP2 optical transceivers. Targeting the testing of high density service provider core routers and high-speed Ethernet cloud infrastructure, the fX 100GbE module validates data plane QoS performance over realistic routing, and cloud infrastructure topologies. The mX 100GbE module featuring Spirent’s Cloud Core, the patent-pending technology designed to add elastic computing to the Spirent Layer 2-7 performance software platform, is ideal for testing the most complex service provider edge/core routers and high performance networks.

-Spirent adds the new SPT-N11U chassis to support the powerful lineup of new and existing high-speed test modules. Designed to lower the total cost of ownership of high density test beds, SPT-N11U brings several innovative capabilities to the market. The capabilities includes double the levels of port density, Intelligent Power Control that lowers the power consumption of high scale test beds by up to 60 percent and four fold improvement in boot time. With a 400 GbE ready architecture, this chassis is the backbone of Spirent’s product portfolio.

“Driven by the proliferation of mobile devices and cloud computing, carrier and data center networks are becoming increasingly complex, and are forced to handle exploding levels of data traffic,” said Ahmed Murad, vice president, Product Marketing and Management at Spirent Communications. “Spirent is committed to developing test solutions that validate these complex networks and their underlying technologies—with realism, at high scale and at high density. The new hardware provide excellent price-performance ratio and a faster time-to-market for customers by combining leading-edge technical innovation with Spirent’s extensive experience in test solutions.”

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