Multilayer low pass filter achieves 50% size reduction
TDK has released a multilayer low-pass filter for LTE and other next-gen high-speed wireless communication systems. Thanks to thinner ceramic layers, finer conductor lines and an optimised internal electrode design, the DEA071910LT-4003B1 achieves a miniaturised footprint of 0.65x0.5mm and a slimmer insertion height of just 0.3mm (form factor 06505).
As a result, this low-pass filter is more than 50% smaller than previous components with a conventional case size of IEC 1005 (1.0x0.5x0.4mm), enabling low-profile designs and module integration. It also offers equal or superior insertion loss and attenuation performance. For example, the maximum insertion loss in the 1.71-1.91 GHz range is just 0.55dB, while the minimum attenuation in the range of 5.13-5.73 GHz is 20dB.
The DEA071910LT-4003B1 operates over the temperature range of -40 to +85°C, and is suitable for use in the RF circuitry of smartphones, tablets and other mobile devices for LTE.
Mass production of the began in January 2015.
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