Design centre for RF applications established near Oxford

25th October 2016
Source: EnSilica
Posted By : Alice Matthews
Design centre for RF applications established near Oxford

Independent provider of semiconductor solutions and IP, EnSilica has further expanded its network of specialist design centres with the establishment of a facility near Oxford (UK) focusing on RF and low power sensing applications. The RF and low power sensing design centre will be headed up by Alan Wong, formerly the IC Design Director at Frontier Microsystems.

Alan joins EnSilica with immediate effect as Director of RF IC Design and rings with him a design team whose pioneering experience in low power RF and sensor interfaces extends EnSilica’s skills-base in addressing the needs of wireless connected IoT and wearable products.

“With their expertise covering Bluetooth Low Energy (BLE), Near Field Communications (NFC) and other proprietary technologies, we are extremely pleased to welcome Alan Wong and his team to EnSilica,” said Ian Lankshear, CEO of EnSilica. “With the team’s proven track record of successfully delivering class-leading low power wireless SoCs and IPs for Wireless Personal Area Networks (WPAN), digital broadcast, medical bio-telemetry and other consumer applications, our new RF and sensing applications design centre has an instant head start in the market.”

The establishment of the RF and sensing design centre grows EnSilica’s headcount to 74 staff over four design centres with around 10% of the staff having PhDs. It also complements EnSilica’s existing headquarters design facility in Wokingham (UK), specialist analogue and mixed-signal IC design centre in Bristol (UK) and specialist design and functional verification capabilities in Bangalore (India).

“The opening of our RF and low power sensing applications design centre near Oxford (UK) is a significant step forward in the ongoing development of our semiconductor design and supply business. It perfectly complements and further extends our existing end-to-end ASIC design capabilities, including systems design, mixed-signal and digital design, embedded software, and operations, to provide us with flexible and scalable RF and sensing design expertise for IoT projects requiring custom ASIC development,” concluded Ian Lankshear.


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