Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications

Mobile backhaul is a critical CAPEX focus area for carriers worldwide as they upgrade their networks to support the hyper growth in mobile broadband traffic. This is driving OEMs to shorten development cycles to quickly bring to market high performance, scalable and flexible backhaul platforms to take advantage of this opportunity.

OEMs will benefit from pre-integrated PtP modem solution IP on Xilinx's All Programmable logic silicon and embedded processor SoCs with total cost of ownership and time-to-market advantages, said Sunil Kar, senior director, wireless communications at Xilinx. With unprecedented levels of hardware and software programmability, the 1024QAM modem IP enables our OEMs to develop generation ahead backhaul platforms with exceptional bandwidth capacity, low latency and low power.

The 1024QAM modem IP solution incorporates all the key features and capabilities that OEMs require to accelerate development of wireless solutions that consume as much as 30 percent less power and which have potential total bill-of-materials (BOM) reduction of up to 30 percent – when compared to ASSP-based products. Ideal for point-to-point outdoor deployments, the modem supports legacy interfaces such as multiple E1/T1 and SDH as well as Gigabit Ethernet interfaces. The data rates are scalable to 1 Gbps in a single polarization and 2 Gbps in dual polarized mode. Increased phase noise tolerance enables the cost of equipment to be optimized and the ability to exploit the benefits of higher order modulations in the field. Key features include supporting modulation from QPSK up to 1024QAM, channel spacing from 3.5 -112 MHz, Adaptive Modulation, Adaptive Digital Pre-distortion, Forward Error Correction, I/Q imbalance correction, automatic frequency recovery, hybrid Decision Directed Equalizer, integrated payload and configuration interfaces.

At the heart of the 1024QAM modem IP solution is Xilinx's All Programmable 7 series devices, built on the state-of-the-art 28nm High Performance, Low-Power (HPL) process technology to deliver breakout performance, capacity and system integration while optimizing price, performance and power consumption.