Minimising time to market on NFC technology

26th June 2018
Posted By : Alex Lynn
Minimising time to market on NFC technology

It has been announced that Near-Field Communication (NFC) technology from STMicroelectronics is powering the contactless features of TCL Communication's newly launched Alcatel 3V smartphone for the European market.

Prioritising enhanced user experience and convenience through Alcatel 3V's NFC features, TCL Communication selected ST's NFC-controller chip for its technology that boosts RF performance without draining battery life.

ST's technology aims for robust connectivity for fast and reliable contactless technology. Superior RF performance also helped TCL Communication to streamline certification to mandatory stringent EMVCo, GSMA and NFC Forum standards for handsets.

Stefan Streit, General Manager for Global Marketing, TCL Communication, commented: "With the all new direction of our Alcatel 2018 smartphone portfolio, we are committed to continuing to deliver high quality and affordably priced smartphones that appear more premium than their price. We are pleased to partner with ST to equip Alcatel 3V with reliable and secure contactless connections for our customers around the globe and to provide even richer experiences and superior interoperability throughout the numerous contactless terminals in their everyday lives. The support provided by ST and the highly effective collaboration between our technical teams helped us quickly achieve the applicable certifications for the Alcatel 3V."

Laurent Degauque, Marketing Director, Secure Microcontroller Division at STMicroelectronics added: "The high RF performance of ST's NFC solution maximises freedom and flexibility to optimise new product designs. Leveraging that flexibility effectively streamlined NFC integration on the Alcatel 3V smartphone, ultimately ensuring shorter time to revenue for our customer, TCL Communication."

ST and TCL Communication aim to extend their collaboration to integrate ST's hardware digital-security solutions into future TCL Communication products. ST has a portfolio of miniaturised, low-power chips, including an embedded Secure Element (eSE) for cryptography and key storage and combined NFC/eSE devices, which are certified to Common Criteria EAL5+ and EMVCo security standards for financial applications. ST also offers a range of solutions and form factors for eSIM.


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