IoT

Simple integration of process data with IoT cloud solutions

20th March 2017
Anna Flockett
0

It has been announced that Softing Industrial’s echocollect gateway now supports the MQTT protocol, making the integration of process data from system and machinery into cloud solutions more straightforward and reliable. Softing Industrial will be exhibiting at Hannover Messe, April 24th-28th 2017, in hall 8, stand E20.

Alongside OPC UA and other control protocols, the new version 7.10 firmware for the echocollect gateway includes publisher functionality from the MQTT (Message Queue Telemetry Transport) protocol.

Sebastian Schenk, Product Manager at Softing Industrial said: “MQTT has developed into one of the most important IoT standard protocols and already has native support from a wide range of leading cloud providers, including Amazon Web Services, IBM Bluemix and Microsoft Azure. We are also supporting this trend by creating a connection between automation and IT: MQTT will make echocollect-driven data integration in cloud-based IoT and Industry 4.0 applications both simple and reliable.”

Characterised by superior flexibility and performance, these features also make the echocollect gateway suitable for process data integration in larger-scale systems. System engineers and end customers benefit from low maintenance costs and robust, reliable operations.

As an industry-optimised gateway, echocollect offers a scalable solution for integrating process data - even from complex systems or multiple machines, for example. Alongside MQTT publisher functionality, data can be made available to ERP, MES or SCADA applications via the integrated OPC UA server. Other functions also offered include bidirectional database connectivity, symbol import from controllers and local data logging to ensure traceability.

The NetCon configuration software including the new 7.10 firmware will be available as a download on the Softing website from April. The MQTT publisher feature can be licensed separately.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier