Displaying 471 - 480 of 488

Nordic Selects NXP Cortex-M0 Microcontroller for Bluetooth 4.0 Low Energy Reference Designs

NXP Semiconductors N.V. today announced that Nordic Semiconductor has selected NXP’s low-power LPC1114 microcontroller in its latest Bluetooth low energy reference designs. Based on the energy-efficient ARM Cortex-M0 processor, the NXP LPC1114 is featured alongside Nordic’s nRF8001 Bluetooth low energy connectivity IC in the nRFready µBlue Desktop reference design for wireless mouse and keyboard.
16th May 2012

NXP Powers NFC in the Samsung GALAXY S III

Today, NXP Semiconductors N.V. announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the best-selling Samsung GALAXY S II.
14th May 2012

GMSK/GFSK Modulation Added to CMX7164

GMSK/GFSK Modulation Added to CMX7164
CML Microcircuits has released a Function Image Update for the high-performance CMX7164 Multi Mode Modem. Function Image 7164FI-1.x adds the use of GMSK/GFSK modulation and is the latest in a roadmap of function enhancements available through CML’s FirmASIC component technology. These updates are designed to add to the device’s functions and features, increasing its flexibility and facilitating in-the-field upgrades.
11th May 2012

PureWave Networks selects Texas Instruments’ wireless infrastructure SoCs for family of LTE small cell base stations

Texas Instruments Incorporated (TI) and PureWave Networks, Inc. announced their collaboration on PureWave’s newly announced PureWave Constellation, a family of LTE small cell base stations, designed to handle up to 1Gbps of data traffic with unmatched ease. With TI’s KeyStone-based wireless infrastructure System-on-Chips (SoCs), including production quality 3GPP compliant LTE PHY software, PureWave Networks is able to more easily design high performance small cell outdoor base stations, at a lower cost, lower power, and in less time than with competing solutions.
8th May 2012

Murata Selects Black Sands CMOS PA's For Use In Integrated RF Front End Products For 3G Handsets

Black Sand Technologies, Inc. today announced that it has been selected to provide silicon PA technology for integrated RF front end products by Murata Manufacturing Co, Ltd. The products will be used to increase integration and improve the performance of 3G smartphones, tablets and datacards.
8th May 2012

Maxim’s Highly Integrated Femtocell Transceivers Simplify Compact Radio Designs

Maxim Integrated Products introduces the MAX2550–MAX2553 femtocell transceivers for WCDMA (Bands 1 to 6 and 8 to 10) and cdma2000 (Band Class 0, 1, and 10). The amount of data consumed by smartphones is rising and the increase in data transmission requires more base-station cell sites to receive and transmit the signals.
8th May 2012

UK Designed and Manufactured RF Connectors Lead the Way on Quality and Delivery

Intelliconnect offers one of the widest ranges of connectors available to designers. Standard connectors include; N,C,TNC, 7/16, SMA, SMB, MCX, Triax, 3.5mm, 2.92mm, 2.4mm, 1.85mm millimetre-wave (“mmwave”) products and Triax and Quadrax types. Intelliconnect can also provide waterproof versions, to IP68 when connectors are unmated, of all of their products if required and fast turnaround custom designs.
1st May 2012

Mindspeed powers the world’s first LTE + Wi-Fi femtocell for SK Telesys

Mindspeed Technologies, Inc. today announced that the company’s Transcede wireless baseband processors are in the first long-term evolution (LTE) femtocell from SK Telesys. The Wi-Fi integrated LTE femtocells will be first deployed in densely populated regions in South Korea, focusing primarily on the commercial centers of major cities.
30th April 2012

Sequans Announces New LTE Reference Designs for Wireless Device Makers

4G chipmaker Sequans Communications S.A. has made available new LTE USB dongle reference designs based on its second generation LTE semiconductor technology. The new family of SQN3120-USB designs can be used to build both FDD and TDD devices and they feature an ultra thin form factor, low power consumption, and a reduced BOM (bill of materials), enabling manufacturers to build sleek and powerful LTE USB dongles very cost-effectively.
27th April 2012

aptX Drives Amazing Wireless Audio Experience in HTC One Series of Smart Phones

CSR plc today announced that HTC Corporation has licensed the CSR aptX audio codec to deliver CD-quality wireless Bluetooth audio in the first three models of the new HTC One series of high-performance smart phones, the HTC One X, One V and One S. All three devices in the HTC One series feature aptX technology designed to ensure CD-quality Bluetooth stereo audio, resulting in a more authentic sound experience when users listen to their favourite music.
24th April 2012

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