Design
Printed & flexible electronics: status, innovations and prospects
What do electronic skin patches, thin-film flexible photovoltaics and automotive interior consoles have in common?
Space-based solar power prepares for lift-off
The UK’s space-based solar power industry is preparing for lift off thanks to a multi-million government investment to develop the cutting-edge technology.
New concept vehicle can fully charge in less than six minutes
Design and engineering business CALLUM, together with developer of ultra-fast-charging batteries, Nyobolt, have revealed the Nyobolt EV.
Infineon accelerate embedded development in ModusToolbox 3.1
Infineon Technologies has announced the release of ModusToolbox 3.1 with enhanced capabilities giving developers more features at their fingertips to develop software solutions for their hardware designs.
Toyochem develops flexible EMI shielding films for smart devices
Toyochem, the polymer and coatings division of Japan’s Toyo Ink Group, has rolled out the new LIOTELAN line of flexible conductive and insulating sheet films for the protection of electrical and electronic equipment.
ARK-1250L honoured with Vision Systems Design Innovators Award 2023
Since 2014, the US magazine Vision Systems Design grants the Vision Systems Design Innovators Awards annually. This year, Advantech’s ARK-1250L DIN-rail edge computer has received a bronze honouree award in the robotics category.
StratEdge semiconductor packages at IMS
StratEdge, a specialist in the design and production of high-performance semiconductor packages for microwave, millimetre-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and moulded ceramic semiconductor packages in Booth 2628 at the International Microwave Symposium (IMS), being held in San Diego, CA, from 13―15 June 2023.
Warning of “real danger” surrounding neurotechnology
The Information Commissioner’s Office (ICO) is warning that newly emerging neurotechnologies risk discriminating against people if those groups are not put at the heart of their development.
Flexible temperature profile for reflow soldering
The ideal temperature profile required for soldering an electronic assembly is subject to a number of factors, including the soldering paste, the components, the circuit board, as well as specific production conditions.
APEC 2024 announces call for industry session proposals
APEC 2024, to be held in Long Beach, California, from 25―29 February 2024, announces the call for submission of Industry Session Proposals for the conference’s increasingly popular presentation series.