Design

Displaying 1 - 10 of 454

802.11ax front end module offers high throughput

Design and sales support for an 802.11ax front end module (FEM) is being offered by distributor RFMW. The Qorvo QPF4206B optimises the power amplifier for 5V operation while maintaining linear output power and leading-edge throughput.
12th April 2019

Audio streaming optimised for gaming headset

Audio streaming optimised for gaming headset
The NXH3670 wireless gaming headphone solution from NXP Semiconductors is in stock at Mouser Electronics. The ultra-low-power single-chip device is a 2.4GHz wireless transceiver with an embedded microcontroller and a proprietary audio streaming protocol to create a solution for gaming headset applications.
8th April 2019

Certified TSS product reduces risk for avionics systems integration

Certified TSS product reduces risk for avionics systems integration
Specialist in edge computing, ADLINK Technology has announced support for both C++ and Java in its Vortex Data Distribution Service (DDS) product. Proven to provide reliable, real-time data sharing for mission critical systems, it has passed all the required tests for conformance certification to Edition 2.1.1 of the Future Airborne Capability Environment (FACE) Technical Standard. 
2nd April 2019


Ease IoT design with third-party platform development flows

Ease IoT design with third-party platform development flows
Taking another high-impact step towards accelerating developers ability to bring differentiated Internet of Things (IoT) products to market, Cypress Semiconductor has announced that its ModusToolbox suite will now provide support for complete device-to-cloud application development flows based on the industry’s most popular open-source IoT platforms.
13th March 2019

Mix-and-match wireless connectivity for developers

Mix-and-match wireless connectivity for developers
It has been announced that Murata is collaborating with Cypress Semiconductor and NXP Semiconductors to provide IoT developers with mix-and-match wireless connectivity and processing solutions that shorten the time-to-market cycle. The combined products pair Murata’s industry-leading wireless modules, based on Cypress’ robust WiFi and Bluetooth combos, with a broad range of best-in-class processors from the NXP i.MX series.
6th March 2019

Development kit addresses BLE IoT applications

Development kit addresses BLE IoT applications
The Bluetooth Low Energy (BLE) IoT Development Kit (B-IDK) from ON Semiconductor is available at RS Components. Based on a low-power Bluetooth Low Energy radio System-on-Chip (SoC), the modular platform is suited to developing IoT applications with extended battery life including smart appliances, asset trackers, wearables, and smart lighting.
5th March 2019

Single-chip adaptable radio platform for 5G wireless applications

Single-chip adaptable radio platform for 5G wireless applications
Xilinx announced it has extended its Zynq UltraScale+ radio frequency SoC portfolio with greater RF performance and scalability. Building on the multi-market success of the Zynq UltraScale+ RFSoC base portfolio, next-gen devices can cover the entire sub-6GHz spectrum, which is a critical need for next-gen 5G deployment. They support direct RF sampling of up to 5GS/S 14-bit Analogue-to-Digital Converters (ADCs) and 10GS/S 14-bit Digital-to-Analogue Converters (DACs), both up to 6GHz of analogue bandwidth.
27th February 2019

Development of mesh WiFi networks simplified with Alexa

Development of mesh WiFi networks simplified with Alexa
Qualcomm has announced a development kit for mesh WiFi networks, qualified by Amazon, to integrate the Amazon Alexa Voice Service (AVS). The Qualcomm Mesh Networking Development Kit offers manufacturers the necessary building blocks to quickly and cost effectively create mesh WiFi systems with Alexa built-in, bringing the convenience of voice control to connected devices throughout the home.
26th February 2019

Software suite shortens the path to IoT monetisation

Software suite shortens the path to IoT monetisation
Telit has announced a new initiative developed to speed IoT deployments and reduce the time required to monetise the digitalisation of businesses called Telit OneEdge. It is a software suite enabling solutions for a new generation of Telit’s cellular LPWA IoT modules. With integrated, secure, easy-to-use tools, it dramatically simplifies design, deployment and management of IoT products and solutions, enabling a leap ahead into the new 5G super-connected world.
18th February 2019

Sensor development kit for power-optimised IoT applications

Sensor development kit for power-optimised IoT applications
Developer of energy efficient innovations, ON Semiconductor, has announced the introduction of the RSL10 Sensor Development Kit, designed to provide engineering teams with a comprehensive platform for developing IoT applications with smart sensor technology, and enabled by the industry’s lowest power Bluetooth Low Energy radio.  
14th February 2019


Design documents


Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

IoT Tech Expo 2019
25th April 2019
United Kingdom Olympia, London
European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona