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Heraeus Electronics GmbH

Heraeus Electronics GmbH Articles

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Latest
6th March 2024
Heraeus and SUSS MicroTec partner for semiconductor inkjet tech

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.

Awards
21st November 2023
Heraeus receives global technology award

Heraeus Electronics has announced its receipt of the ‘2023 GLOBAL Technology Award’ in the category of Solder Paste.

Awards
27th October 2023
Heraeus Electronics wins 2023 Mexico Technology Award

Heraeus Electronics is pleased to announce that it has been honoured with a 2023 Mexico Technology Award in the category of Solder Paste – No-clean.

Awards
13th September 2023
Heraeus honoured as Best Material Supplier 2022

Heraeus Electronics has been awarded ‘Best Material Supplier of 2022’ by STMicroelectronics’ Bouskoura test and assembly site.

Events News
7th September 2023
Pastes for the next era of mobility at SMTA International 2023

Heraeus Electronics is pleased to announce its participation at SMTA International, a premier event for electronics manufacturing and assembly professionals.

Design
30th August 2023
Project ‘KuSIn’: driving e-mobility with copper sinter innovations

Heraeus Electronics, an expert in materials and matched material solutions for the electronics packaging, is one of five partners in the three-year joint project ‘KuSIn - Copper sinter processes using induction heating for electromobility application,’ funded by the German Federal Ministry of Economic Affairs and Climate Action (BMWK).

News & Analysis
3rd August 2023
Heraeus Electronics receives Bosch Global Supplier Award

Heraeus Electronics has been honoured by Bosch, a leading global supplier of technology and services, with the renowned Bosch Global Supplier Award in the category "Raw Material and Components" for its exceptional performance.

Design
18th July 2023
Heraeus introduces PTC4900 series heater inks

Heraeus Electronics introduces the PTC4900 Series self-regulating heater inks, a breakthrough in heater technology.

News & Analysis
30th May 2023
Heraeus Electronics and Bosch sign patent and know-how license agreement for inorganic potting technology

Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. 

Design
29th March 2023
Heraeus Electronics develops new production-friendly flexible end termination ink

Heraeus Electronics is pleased to announce the development of a production-friendly, flexible passive component termination ink.

Design
24th February 2023
Heraeus Electronics launches new Innolot 2.0 solder paste

Heraeus Electronics announces the release of its new Microbond SMT660 Innolot 2.0 no-clean printing T4 solder paste.

Power
30th January 2023
Heraeus Electronics showcases next-generation power electronics and semiconductor packaging at SEMICON Korea 2023

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place 1st – 2nd February 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Events News
23rd January 2023
Heraeus Electronics provides latest materials portfolio at NEPCON Japan 2023

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place 25th to 27th January 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Events News
15th December 2022
Heraeus to release solder paste for automotive SMT applications

Heraeus Electronics will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Centre in California.

Power
16th May 2022
Optimised copper ribbon for laser bonding

Heraeus Electronics announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.

Industries
3rd May 2022
Heraeus Electronics to present at PCIM Europe

Heraeus Electronics has announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe.

Power
21st July 2020
Heraeus bonding ribbon for next gen power electronics

Heraeus Electronics has announced the expansion of the PowerCuSoft product family with a new copper bonding ribbon. The product enables power modules to be designed and manufactured more reliably, efficiently and cost-effectively.

Production
8th July 2020
Copper bonding ribbon aids power module manufacture

Heraeus Electronics has expanded its PowerCuSoft product family with a new copper bonding ribbon.

Production
11th May 2020
Copper core aluminium wire targets power applications

A next generation wire for power applications has been released by Heraeus Electronics.

Latest
30th March 2020
Heraeus gains IATF certification for quality management

Heraeus Electronics has received the 16949 certification of the International Automotive Task Force (IATF) for its site in West Conshohocken, Pennsylvania. The accredited verification ensures that the requirements for international quality systems for the automotive industry are fulfilled at any time.

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