Qorvo has announced a series of innovations intended to accelerate the deployment of high-speed CAble TV (CATV) DOCSIS 3.1 networks while providing cable designers greater flexibility in product design. Qorvo's latest Multi-Chip Module (MCM) packaging, thermal sensing pins and advanced GaN on SiC integration capabilities enable CATV product designers to lower costs, increase bandwidth and reduce board space.
Qorvo's MCM packaging helps customers reduce board space by up to 50% and enables up to 30% cost savings versus traditional SOT115J packaging. Qorvo's MCM packaging includes temperature-sensing pins, which ensure proper assembly and provide optimal thermal management. To facilitate the use of its newest advanced MCM capabilities, Qorvo offers customers PCB layout and thermal design support services.
Multi-system operators can leverage the market leading output and gain performance of Qorvo's GaN on SiC technology to upgrade equipment within existing product footprints, saving installation time and cost while enhancing performance. Additionally, Qorvo's GaN on SiC technology helps reduce overall power consumption by up to 20% with associated features such as adjustable current control.
Kellie Chong, Director, CATV and Broadband Access products, Qorvo, said: "Qorvo is leveraging our broad portfolio of advanced packaging and process technologies to help leading CATV customers lower costs, increase bandwidth and achieve significant board space savings. Qorvo has shipped more than 2m CATV GaN amplifiers and is the industry-leading GaN supplier for the cable market. We are pleased to offer customers the benefits of our newest innovations to accelerate the deployment of their DOCSIS 3.1 networks."
Qorvo's latest DOCSIS 3.1 products include the RFCM3316 and RFCM3326 GaN-based power doubler amplifiers and are available in miniaturised 9x8mm MCM packaging.