Remote SIM provisioning in cellular modules for IoT devices

26th February 2019
Posted By : Lanna Cooper
Remote SIM provisioning in cellular modules for IoT devices


A collaboration between Murata and Truphone has been announced, which will see the companies combining their technologies and services in order to take a lead in the eSIM revolution for the Internet of Things (IoT) and Machine-to-Machine (M2M) devices.

The two companies are working at the forefront of transformative technologies. Murata is advancing a variety of IoT applications and has developed a low power cellular module for IoT/M2M devices. These modules lower battery consumption, make space for device makers and reduce the cost of production.

The low power Murata module incorporates ST Microelectronics’ ST33 M2M eSIM which is a fully compliant GSMA solution suitable for remote SIM provisioning. At 2x2mm, the Wafer Level Chip Scale Package (WLCSP) that the eSIM comes in is a remarkably small SIM card, paving the way for ever-smaller devices that are less prominent and provide a more seamless integration into their operating environment.

Truphone’s role has been to enable the module to connect out of the box to low power wide area technologies across numerous countries via its bootstrap connectivity technology implemented by the GSMA.

In addition, the company has supplied its GSMA-accredited M2M remote SIM-provisioning application that, when integrated with the bootstrap connectivity, enables the device to obtain a SIM profile from other mobile operators allowing for continuous local connectivity.

Jim Philipp, Senior Marketing Manager at Murata said: “The world of IoT devices is broad and complex, and especially so for narrow-band technologies. With this module, and the integration of technology from Truphone and ST, we’re simplifying the supply chain for anyone in the IoT market who wants powerful connectivity, cost saving hardware and a geographical footprint to keep up with their business.”

Steve Alder, Chief Business Development Officer at Truphone said: “One barrier to mass adoption of IoT is the complexity device makers face in connecting their devices. This collaboration with Murata brings together all the elements, packaged together in a way that allows device makers to get connected simply and efficiently.

"With Truphone’s global bootstrap connectivity and remote SIM provisioning, device makers can manufacture a single worldwide model type for the globe, and then configure the device over the air to allow it to connect locally, wherever it is unboxed.”

You must be logged in to comment

Write a comment

No comments

Sign up to view our publications

Sign up

Sign up to view our downloads

Sign up

European Microwave Week 2019
29th September 2019
France Porte De Versailles Paris
Connected World Summit 2019
22nd October 2019
United Kingdom The Business Design Centre, London
IoT Solutions World Congress 2019
29th October 2019
Spain Barcelona