5G

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Partnership to deliver 4G and 5G Open vRAN Solutions

Partnership to deliver 4G and 5G Open vRAN Solutions
Provider the end-to-end software-based unified network solution across All Gs (2G, 3G, 4G, and 5G), Parallel Wireless, along with Comba Telecom, announced a partnership on delivering 4G and 5G virtualised Open RAN (Open vRAN) solution. The resulting solution integrates Parallel Wireless software with Comba Remote Radio Unit (RRU) and base station antennas and leverages its integration services.
26th February 2019

Intelligent connectivity solutions to master 5G challenges

Intelligent connectivity solutions to master 5G challenges
Manufacturer of components and systems for electrical and optical connectivity, HUBER+SUHNER, will unveil its solutions for mobile network densification at booth #6G20 at this year’s Mobile World Congress. The company’s presence at the show will focus on the forthcoming topology changes necessary to prepare for the continuously growing capacity requirements and complexity of the future 5G network.
26th February 2019

5G compatibility via micro-operator functionality

5G compatibility via micro-operator functionality
Global innovator in turnkey IoT solutions and smart connectivity, UROS Group, has demonstrated compatibility with 5G technologies by completing a mobile data call over a connection provided by its Goodspeed service at the local 5G Test Network facilities in Oulu, Finland.
26th February 2019


5G NR beam-steering gateway antennas launched at MWC 2019

5G NR beam-steering gateway antennas launched at MWC 2019
Taoglas has announced the launch of the Taoglas 5G NR KSF.410, a new 5G millimeter wave beam-steering antenna targeting frequency bands 27.5-28.35GHz. The KSF.410, according to the company it is the industry’s first antenna utilising beam-steering chipsets from Analog Devices, is being showcased this week at Taoglas’ stands at Mobile World Congress 2019 in Barcelona, Spain, and Embedded World in Nuremberg, Germany.
26th February 2019

MACOM, STMicro extend GaN-on-Silicon production pact

MACOM, STMicro extend GaN-on-Silicon production pact
The impending roll out of 5G services has prompted MACOM and STMicroelectronics to extend their agreement on 150mm GaN-on-Silicon production capacity in ST’s fabs, along with a shift to 200mm as demand requires. This builds upon the broad GaN-on-Silicon agreement between MACOM and ST announced in early 2018.
25th February 2019

End-to-end solutions for 5G infrastructure deployments

End-to-end solutions for 5G infrastructure deployments
Marvell has announced a highly flexible end-to-end optimised 5G platform specifically tailored to exceed OEM design demands, accelerate development of 5G New Radio (5G NR) systems and, ultimately, speed global carrier deployments. Marvell’s market position in wireless networking technology has grown with each successive generation of wireless standards.
25th February 2019

GaAs ICs drive breakthrough 5G technology

GaAs ICs drive breakthrough 5G technology
A breakthrough technology which will facilitate more efficient delivery of mobile and broadband services to offices and homes is being spearheaded by a collaboration between the inventors, Pivotal Commware and compound semiconductor supplier MACOM.
24th February 2019

5G SIM to unleash the potential of next generation networks

5G SIM to unleash the potential of next generation networks
Gemalto has announced the industry-first 5G SIM in order to meet operator requirements for the new generation of network deployments which will emerge in 2019. Compliant with the latest ETSI 3GPPspecifications and SIMalliancerecommendations, the 5G SIM is defined by them as the only solution capable of securing 5G network access. The Gemalto 5G SIM brings not only improved data privacy and seamless 5G global roaming imposed by the latest standards but is also the first to add enhanced protection against hacking to anticipate future requirements.
22nd February 2019

5G ready multi-technology module launched

5G ready multi-technology module launched
The launch of a new 4G/3G small cell integrator module software upgradable to 5G, has been announced by ip.access, as part of its carrier grade OEM platform portfolio. The new E62 multi-Radio Access Technology (multi-RAT) integrator carrier grade platform is a compact format with dual-band radio, designed in close collaboration with the company’s customers and partners.
22nd February 2019

Wireless broadband networking with fast 5G speeds

Wireless broadband networking with fast 5G speeds
Global enabler of the Internet of Things (IoT), Telit, has announced that it will be a providers of data cards based on Qualcomm Technologies’ second generation 5G New Radio (NR) modem, the Snapdragon X55 5G modem and their antenna modules with integrated RF transceiver, RF Front-End (RFFE) and antenna elements, representing an important milestone in the Telit roadmap.
22nd February 2019


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Anti-Counterfeiting Forum 2019
20th March 2019
United Kingdom Farnborough, Hampshire
The Security Event 2019
9th April 2019
United Kingdom NEC, Birmingham