Communications
ServiceNow and NVIDIA introduce Telco-specific GenAI solutions
ServiceNow and NVIDIA announced that they are broadening their relationship with the introduction of telco‑specific generative AI solutions to elevate service experiences.
New funding puts UK at heart of next-gen telecommunications
The UK Space Agency has unveiled a £10 million funding competition aimed at propelling UK firms to the forefront of the burgeoning telecommunications sector globally.
Wiwynn introduces next-gen Edge server lines and cooling
Wiwynn will showcase its next-gen Edge computing solutions and cooling technologies at Mobile World Congress Barcelona 2024, located at booth 5A61, Taiwan Pavilion.
Navitas powers Samsung Galaxy S24 with integrated AI
Navitas Semiconductor, the pure-play, next-generation power semiconductor company and industry pioneer in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced that its GaNFast power ICs drive Samsung’s 25W ‘Super-Fast Charging’ (SFC) for the new, AI-enhanced Galaxy S24 smartphone.
Hiya launches global telecom solution for spam-free business calls
Hiya, the global pioneer in voice security, announces Hiya Registration, a free solution for businesses which ensures that customer-friendly calls – which respect both consumer preferences and applicable laws – are delivered without spam or nuisance labelling or blocking on mobile networks across the globe.
Rohde & Schwarz tests Quectel 5G eCall with its tester
Quectel Wireless Solutions, a global IoT solutions provider, and Rohde & Schwarz have successfully validated Quectel’s innovative 5G eCall module, part of the AG56xN series of automotive modules.
Nordic expands nRF91 Series with nRF9151 SiP
Nordic Semiconductor, a provider of low power wireless connectivity solutions, announces the expansion of its nRF91 Series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Transceiver ICs eliminate connectors, cables
New short-range wireless point-to-point transceiver ICs from STMicroelectronics remove the need for cables and connectors in consumer-friendly accessories and personal electronics like digital cameras, wearables, portable hard drives, and small gaming terminals.
Successful demonstrate Open vRAN and 5G Core UPF using Arm-based CPUs
NEC Corporation together with Arm, Qualcomm Technologies, Red Hat, and Hewlett Packard Enterprise (HPE) have successfully demonstrated end-to-end operation of NEC's Open virtual Radio Access Network (vRAN) and 5G Core virtual User Plane Function (vUPF) products using the HPE ProLiant servers running Arm Neoverse-based CPUs and the Qualcomm X100 5G RAN Accelerator Card, with Red Hat OpenShift in conditions equivalent to a commercial environment.
Belden launches Hirschmann BXP managed switch
Belden, a global supplier of network infrastructure and digitisation solutions, has announced the launch of its Hirschmann BXP (BOBCAT eXtreme Performance) managed switch.