Murata has announced a compact low cost LPWAN (Low Power Wide Area Network) wireless module that supports the LoRaWAN long range wireless protocol. This standalone compact module measures just 12.5x11.6x1.76mm, is constructed in a metal shielded package and comprises a Semtech SX1276 ultra long range spread spectrum wireless transceiver and an ST STM32L0 series ARM Cortex M0+ 32 bit MCU.
An integrated TCXO that has robust low drift thermal characteristics provides an accurate clock source for the RF transceiver.
Communication with the module can be achieved via UART, SPI or I2C peripheral interfaces. An ADC and up to 18 GPIOs provide plenty of flexibility for connecting sensors, switches and status LEDs, and the module is powered from a 2.2 to 3.6VDC supply. The Murata CMWX1ZZABZ-078 module has pre-certified radio regulatory approvals for operating in the 868 and 915MHz ISM spectrum in most geographical regions of the world.
The normal output power is + 14dBm but a PA boost function can be selected to increase RF output to +20dBm for long range applications or those where the end-device is sited in a poor signal location indoors.
The MCU includes 192kB flash and 20kB RAM, and has enough memory to embed customer applications and host other modulation stacks. In addition, an optional STSAFE secure element can be incorporated into the MCU to enhance the network security capabilities.
Marc Pegulu, Vice President and General Manager, Wireless and Sensing Product Group, Semtech, commented: "We're excited to welcome a leader in wireless modules such as Murata into the LoRa ecosystem. Since Murata joined the LoRa Alliance, our teams have worked together to design a cost-effective, small form factor LoRaWAN module capable of supporting a wide range of sensors. We are confident Murata's new wireless module should help increase the adoption of the LoRaWAN platform worldwide, helping to make it the standard for LPWANs supporting low power IoT applications."
Typical applications for this module include smart metering, wearables, tracking, M2M and IoT edge nodes. Accommodating a wide range of temperatures, the module can operate from -40 to +85°C.
Mass production will commence in October 2016.