RF backplane connection system suits high-density applications
HUBER+SUHNER announces a VITA 67 multi-coaxial RF backplane connection system designed for side-by-side implementation with VITA 46 and VITA 66 hardware. The devices are specifically for high-reliability, high-density military applications such as communication systems and ground base stations, avionics, ground-based radar systems as well as other critical high frequency applications.
According to HUBER+SUHNER, this VITA 67 solution is the first true high-density, high-performance 65GHz coaxial interconnect system on the market. System accuracy is improved as the connection system offers suitable phase stability versus temperature and bending.
Insertion loss depends on the cable selected for the application while maximum VSWR at 40GHz is 1.55:1 and 1.75:1 at 65GHz. Operating temperature range is -65 to +155°C.
Available in 4 position SMPM and 8 position SMPM configurations, this VITA 67 connection system incorporates the company’s solderless Minibend bend-to-the-end technology with the tightest bending radius (0.06"/1.5mm) and right behind the connector. It can be assembled using cables with a diameter of 0.086" and smaller and the snap-in captivation method guarantees quick, easy and precise installations without tooling or loose parts.
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