IoT
Panasonic Industry’s range of BLE modules available on short lead times
Despite the tense situation on the semiconductor markets for the past two years, Panasonic Industry has invested heavily in stocks – and now reports that, for instance, the Bluetooth Low Energy modules from the PAN1780 family are available in short lead times.
ROHM’s SerDes ICs for automotive multi-displays simplify video transmission
ROHM has developed full-HD (1980 × 1080px) compatible SerDes ICs (Serialiser: BU18TL82-M, Deserialiser: BU18RL82-M) – optimised for multi-screen vehicle displays.
REYAX Technology launches Helium compatible LoRaWan transceiver module
REYAX Technology has announced the launch of a 868/915MHz Transceiver Module RYLR993, which supports the LoRaWAN long range wireless protocol.
Helium Deploy partners with Baicells to bring US Helium 5G Network to international community
Baicells and Helium Deploy have announced a partnership to bring the Helium Network opportunity to the international community.
MatterTM to simplify use of Matter standard
NXP Semiconductors has announced MatterTM-enabled development platforms that simplify and accelerate the creation of Matter devices for smart homes and buildings.
In the hot seat: how the Cloud is taking the pressure off thermal engineers
When it comes to designing electronics, thermal engineers are required to run the gauntlet faster than ever. In an incredibly competitive marketplace, and with consumers' expectations at an all-time high, designers, manufacturers, and engineers are under financial pressure to develop products that can do more with less. Tom Gregory, Product Manager, Future Facilities Ltd discusses.
IoT gateway enables secure Edge to Cloud connectivity
Embedded systems and display solutions provider, Review Display Systems (RDS) has introduced a new Standard IoT Gateway System from AAEON.
Synopsys advances designs on TSMC N3E process
Building on a long-standing collaboration with TSMC to drive continued innovation on advanced process nodes, Synopsys has announced several key achievements on the TSMC N3E process technology.
Rockwell Automation process efficiency and improve sustainability at ADIPEC 2022
Rockwell Automation, the global specialist dedicated to industrial automation and digital transformation, and Sensia, Rockwell's joint venture with Schlumberger, will showcase innovative technology and services along with other industry partners at ADIPEC 2022, 31 October – 3 November in Abu Dhabi, United Arab Emirates.
Tech evolution is outpacing consumer interest
The pace of innovation in the tech industry is causing drag in the consumer market, with many struggling to embrace new products, according to new research from Studio Graphene.