Wireless
New noise-cancelling IC from ams helps OEMs deliver better audio quality in wireless headsets
ams introduced today the AS3421 and AS3422, single chip ANC solutions with integrated speaker driver ICs, which make it easier for manufacturers of Bluetooth headsets, headphones and earpieces to implement Active Noise Cancellation.
Analog Devices Unveils Industry's Fastest 12-bit, Direct Digital Synthesizers for Frequency-Agile Wireless Applications
Meeting the demand for direct digital synthesis technology that meets the needs of wireless applications requiring fast hopping and/or sweeping, Analog Devices, Inc. today announced that it has more than tripled the clock speed of previously available DDS integrated circuits.
NXP Unleashes Multi-Stage Variable Gain LNAs for Wireless Base Stations
NXP Semiconductors N.V. today introduced the BGU706x series of multi-stage base station LNAs with variable gain featuring the industry’s lowest noise figure of 0.9 dB for a receive chain in silicon. The architecture of the LNA is based on the integration of a very low-noise LNA with a bypass function followed by an analog-controlled variable gain amplifier.
New generation of M-bus Wireless modules
ADEUNIS RF has developed a compact and high performance WMBUS module, incorporating an M-Bus software stack and an applications layer with counter and gateway profiles. Thanks to its unrivalled performance (-117dBm RF sensitivity / 131dBm radio power), our M-Bus Wireless module can be used to create a bidirectional digital link over distances up to 1000m.
RFPA1012 GaAs HBT 400MHz to 2700MHz Power Amplifier
RFMD’s new RFPA1012 GaAs HBT linear Power Amplifier is specifically designed for wireless infrastructure applications. Using a GaAs HBT fabrication process, this high performance single-stage amplifier achieves a high IP3/DC power ratio that operates over a broad frequency range.
Sierra Wireless unveils the world’s thinnest 4G LTE embedded module
Sierra Wireless today introduced the world’s first thin form factor embedded wireless module for 4G LTE networks. The AirPrime EM7700 embedded wireless module measures only a nominal 2.5 millimeters thick and is designed for use in ultraportable notebooks, tablets, and other devices where thinness is a critical design constraint. Shipments are expected to begin in the second quarter of this year.
TI’s OMAP processors and WiLink connectivity solutions together expected to provide rich Miracast experiences with display over Wi-Fi
Texas Instruments Incorporated today announced availability of a complete solution for mobile devices designed to support Wi-Fi CERTIFIED Miracast, based on the Wi-Fi Alliance Wi-Fi Display Specification, enabling users to reliably display full high definition content from a mobile device onto a larger screen over a secure, low-latency, wireless network connection.
RFHA1006 225MHz to 1215MHz, 9W GaN Wideband Power Amplifier
RFMD’s new RFHA1006 is a wideband Power Amplifier designed for CW and pulsed applications such as wireless infrastructure, RADAR, two-way radios and general purpose amplification. Using an advanced high power density Gallium Nitride (GaN) semiconductor process, these high-performance amplifiers achieve high efficiency, flat gain, and large instantaneous bandwidth in a single amplifier design.
Introducing u-blox 7, the world’s lowest-power multi-GNSS platform
u-blox is proud to announce the launch of its next generation core positioning technology platform u-blox 7. Supporting all deployed as well as soon-to-be deployed Global Navigation Satellite Systems, the platform is based on the UBX-G7020 multi-GNSS receiver IC which boasts the lowest power consumption on the market by at least a factor of three as compared to other standalone solutions.
Broadcom Unlocks Potential of 5G WiFi with Integrated SoCs for Home and SMB Networks
Broadcom Corporation today announced the industry's first SoC devices to deliver the potential of 5G WiFi with high-bandwidth Gigabit connectivity to the home and SMB network. Designed as companions to its full line of 5G WiFi 802.11ac solutions, the new Broadcom SoCs are the industry's first to combine a high performance processor, GbE switch, GbE physical layer transceivers, USB 3.0 and traffic accelerators all on a single chip.