Wireless
Peregrine Semiconductor Announces High-Frequency, High-Power 7-bit Digital Step Attenuator
Peregrine Semiconductor today announced from booth #1811 at the International Microwave Symposium in Seattle that it has expanded its line of high-frequency products with a precision 7-bit Digital Step Attenuator.
Compact High-Output Millimeter-Wave Transceiver Module
Fujitsu announce the development of a gallium-nitride HEMT-based transceiver module technology that features an output of 10 W and operates at frequencies up to the millimeter-wave band. Until now, developing high-output modules that operate in the millimeter-wave band has required modules consisting of separately packaged components to allow for sufficient heat dissipation. As a result, it has been difficult to produce compact modules.
ADI’s MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health
Analog Devices today introduced a wireless vibration sensing system that allows industrial systems operators to remotely monitor production equipment health, improve system performance and reduce maintenance costs.
MediaTek unveils new 2x2 802.11ac Wi-Fi Chipset Solutions
MediaTek today announced the launch of its innovative MT7612x series, the industry’s first 2x2 802.11ac Wi-Fi chipset solutions that include fully integrated 2.4GHz and 5GHz power amplifiers supporting calibration free capability, together with the high output power previously only achievable with external PA solutions.
Broadcom Boosts Performance of NAS Devices with New SoCs
Broadcom today announced a new line of high-performance processors for wired and wireless network attached storage devices and routers. The StrataGX BCM5862X Series offers a 10x increase in performance with the ARM-based FlexSPARX engine,1 while integrating enhanced security and storage features to support hybrid cloud services.
Broadcom Expands Portfolio of 5G WiFi Chips for the Connected Home
Broadcom announced it has expanded its 5G WiFi portfolio with a line of 2x2 5G WiFi products. The new chips deliver the speed, range and power necessary for connected home devices, including PCs, tablets, set-top boxes, TVs, and retail routers. New 5G WiFi products will be showcased at COMPUTEX TAIPEI 2013.
First Affordable Retail Cloud WiFi hotspot solution to truly capture and leverage customer information now available worldwide
Ormit Solutions Ltd & Tanaza announced today the availability of a brand new multi‐vendor Wi‐Fi solution ‘Captive Access’ that enables retail stores, shopping malls, restaurants and cafés to leverage the impact of their customer hotspots.
DMTL Samples Smallest Thin-Film 10W 3dB Directional Couplers for Wireless Communications
DMTL has added to its high reliability component offering for the wireless communications industry with the introduction of what is claimed to be the smallest thin-film 10W 3dB directional couplers currently available.
Broadcom Delivers Single-Chip Wi-Fi Solution for Embedded Devices
Broadcom today announced a new Wi-Fi system-on-a-chip for embedded devices. The BCM4390 chip is part of Broadcom's Wireless Internet Connectivity for Embedded Devices portfolio to be showcased at COMPUTEX TAIPEI 2013.
LPRS Unveils Complete SoC Integrated Wireless Controller at Fortronic Wireless 2013
LPRS will be launching its new low cost easyRadio Integrated Controller – eRIC - at the Fortronic RF and Wireless Technical Forum on June 25th at the Williams F1 conference centre near Oxford. At half the size and half the cost of the long established and field proven easyRadio range, eRIC remains true to the easyRadio brand with many of the easyRadio features and benefits of eRA.