Wireless
RFaxis Unveils Multiple Pure CMOS 5GHz 802.11ac Wi-Fi RFeICs
RFaxis today announced that it’s starting volume production of multiple products in the company's patented RF Front-end IC (RFeIC) portfolio. The RFX8050x and RFX8051x family of RFeICs will start shipping in volume in Q3 2013.
Qualcomm Advances Next-Generation Wi-Fi
Qualcomm is giving 802.11ac a boost with its family of Qualcomm VIVE 802.11ac Wi-Fi solutions. Qualcomm has gained strong traction in original equipment manufacturer devices across both mobile and networking segments, and is offering significant 11ac performance advantages compared to competitive solutions in both rate-over-range and power consumption.
Qualcomm Announce Multi-Mode 3G, 4G, Wi-Fi Small Cell Solutions
Qualcomm announce a family of 28 nanometer solutions, the Qualcomm FSM99xx, that enable pico, metro and enterprise small cells that are designed to enhance operators’ 3G and LTE networks. The Qualcomm FSM99xx solutions integrate the company’s 3G and 4G technologies and support advanced 802.11ac/n Wi-Fi to enable full-featured small cells that are designed to provide superior performance with greater power efficiency.
Nujira signals start of volume production ramp with launch of highest performing Envelope Tracking chip for mobile handsets
Nujira has unveiled its newest Coolteq.L ET power supply modulator chip for LTE handsets. Nujira's NCT-L1300 delivers the best ET modulator performance on the market across all key metrics: system efficiency, noise, bandwidth, linearity and RF output power. The new chip is now being geared up for volume production to support 4G smartphone shipments in 2014.
Infineon introduces new high performance TVS diodes for protection in wireless devices
Infineon Technologies introduces a new Transient Voltage Suppressor diode series to protect antennas and front-end devices from transient voltage events. The new ESD101x and ESD103x diodes absorb dangerous electrostatic discharges to prevent damage to the antenna system while maintaining signal integrity.
Peregrine Semiconductor Announces High-Frequency, High-Power 7-bit Digital Step Attenuator
Peregrine Semiconductor today announced from booth #1811 at the International Microwave Symposium in Seattle that it has expanded its line of high-frequency products with a precision 7-bit Digital Step Attenuator.
Compact High-Output Millimeter-Wave Transceiver Module
Fujitsu announce the development of a gallium-nitride HEMT-based transceiver module technology that features an output of 10 W and operates at frequencies up to the millimeter-wave band. Until now, developing high-output modules that operate in the millimeter-wave band has required modules consisting of separately packaged components to allow for sufficient heat dissipation. As a result, it has been difficult to produce compact modules.
ADI’s MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health
Analog Devices today introduced a wireless vibration sensing system that allows industrial systems operators to remotely monitor production equipment health, improve system performance and reduce maintenance costs.
MediaTek unveils new 2x2 802.11ac Wi-Fi Chipset Solutions
MediaTek today announced the launch of its innovative MT7612x series, the industry’s first 2x2 802.11ac Wi-Fi chipset solutions that include fully integrated 2.4GHz and 5GHz power amplifiers supporting calibration free capability, together with the high output power previously only achievable with external PA solutions.
Broadcom Boosts Performance of NAS Devices with New SoCs
Broadcom today announced a new line of high-performance processors for wired and wireless network attached storage devices and routers. The StrataGX BCM5862X Series offers a 10x increase in performance with the ARM-based FlexSPARX engine,1 while integrating enhanced security and storage features to support hybrid cloud services.