Design

Hermon Laboratories chooses CommAgility DSP and RF modules for LTE handset test

14th February 2013
ES Admin
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CommAgility announced today that its Advanced Mezzanine Card modules are being used in the latest LTE test equipment from Hermon Laboratories. CommAgility will be at the Hermon Laboratories booth at Mobile World Congress (Stand 6F53 in Hall 6) to demonstrate how its DSP processing and RF boards have helped Hermon to create cost-effective, high performance LTE test products.

Hermon uses CommAgility’s AMC-2C6670 and AMC-RF2x2 modules in its G9200 Radio Conformance Analyzer, which provides a complete test solution for LTE handsets. The CommAgility boards provide processing power and RF capabilities that enable G9200 to achieve the high performance and compact size required by Hermon.

G9200 provides a ‘lab in a box’ that integrates multiple testing technologies into a single 6U unit, compared to competitor solutions that require a larger, more expensive rack. The testing provided includes RF and radio measurements, protocol analysis, performance testing, TCP/IP application and performance testing, as well as voice quality and Voice over LTE (VoLTE) testing.

“The CommAgility boards provide high levels of DSP processing power and a flexible radio interface, enabling us to integrate multiple technologies into one compact product,” said Alex Usoskin, CEO at Hermon Laboratories. “Technology is evolving all the time, and with CommAgility we have a solution that will support us and our roadmap now and in the future.”

“LTE test is one of the most demanding applications around, and it’s a mark of our modules’ capabilities that Hermon have chosen them as the core of their new G9200,” said Edward Young, managing director at CommAgility. “Whether it’s for handset test or wireless infrastructure, our AMC modules have the right mix of features and power that’s needed.”

The AMC-2C6670 is a high performance signal processing AMC card for 4G wireless baseband and test equipment, including LTE and LTE Advanced. It provides two Texas Instruments TMS320C6670 DSPs, each with four 1.2GHz C66x cores, as well as a Xilinx Virtex-6 LX240T FPGA. Flexible I/O includes a 20Gbps Gen2 Serial RapidIO infrastructure, full Gigabit Ethernet, and three front panel SFP+ optical interfaces.

The AMC-RF2x2 is a wideband, highly flexible dual channel RF card, aimed at LTE and LTE Advanced applications. It provides two RF ports supporting both FDD and TDD modes across all LTE and LTE Advanced bands. Digital down converter (DDC) and digital up converter (DUC) operations are conducted by integrated firmware within the on-board Xilinx Virtex-6 FPGA. Two SFP sockets support a CPRI or OBSAI interface.

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