Design
Addressing three key space applications
Electronics intended for space missions face unique conditions and challenges – specialised integrated circuit (IC) packaging can help mitigate some of those challenges.
Robust fanless 5G digital signage player for demanding outdoor environments
IBASE Technology, a specialist provider of industrial computers and digital signage players, has released the SE-603-N outdoor digital signage player.
Cost-efficient InGaAs APDs
LASER COMPONENTS expands its range of InGaAs APDs (avalanche photodiodes) with its new IAL series.
OKI IDS adopts Siemens catapult synthesis platform
Siemens has announced that OKI IDS has adopted Siemens Catapult software for High-Level Synthesis (HLS) and High-Level Verification (HLV) in its design and verification services.
ZTE intelligent computing infrastructure at MWC Shanghai
ZTE has demonstrated a new type of intelligent computing infrastructure at the 10th MWC Shanghai.
TouchNetix expand aXiom product offering with BGA package
Building on its aXiom product family offering, TouchNetix announces the introduction of ball grid array packaging (BGA) for its largest aXiom chip, the AX198A.
Toshiba announces 100V N-Channel MOSFET
Toshiba Electronics Europe has launched a new 100V N-channel power MOSFET based upon its latest generation U-MOSX-H process.
Industrial Metaverse essential for UK fusion energy development
The engineering designs of UKAEA’s prototype fusion energy plant, STEP, sited in Nottinghamshire, will be developed in a highly immersive and connected virtual environment, known as the ‘Industrial Metaverse’.
XENSIV MEMS microphone with analogue interface
Infineon has introduced the XENSIV MEMS microphone, with flat frequency response, to its automotive microphone portfolio.
Designing Single- and Three-Axis Selfie Sticks With MSPM0 MCUs
Presently, there are two main types of selfie stick products on the market: single-axis selfie sticks and threeaxis selfie sticks. How can a selfie stick guarantee the shooting stability of mobile phone? Learn more with this application brief by Texas Instruments.