Companies

Infineon Technologies AG

We make life easier, safer and greener

The world’s swelling population, more and more megacities and the rising demand for energy is prompting us to rethink many aspects of our modern lifestyle.

Semiconductor and system solutions from Infineon contribute to a better future – making our world easier, safer and greener. These tiny, barely visible electronic components have become an indispensable part of our daily lives. They help to feed regenerative energy into power grids with almost zero losses, tame power-hungry computers, safeguard the data flying through cyberspace and make our cars more energy-efficient.

Infineon Technologies AG Articles

Displaying 861 - 863 of 863
Pending
16th December 2009
Infineon Introduces Low-Cost Driver Family for Half Watt LEDs

Infineon Technologies is extending its portfolio of energy efficient lighting ICs with a new family of low cost linear LED drivers. The new BCR320 and BCR420 product families address the burgeoning market for energy-saving and environmentally friendly light-emitting diode (LED) lighting solutions. Specifically designed for driving 0.5W LEDs with a typical current of 150mA to 200mA, these LED drivers feature a negative thermal coefficient contrib...

Analysis
16th December 2009
Infineon’s TPM Security Chips Receive Global TCG and Common Criteria Certification and UK Government Approval; Showing World Trust in Infineon Security Expertise for PC and Data Network Protection

Infineon Technologies today announced it is the world’s first semiconductor provider of TPM (Trusted Platform Module) security chips that successfully passed most stringent security tests currently defined for PC security. The Trusted Computing Group (TCG), an impartial not-for-profit organization, confirmed that Infineon’s TPM is “TCG Certified”. The TCG certification is based on the international security standard “Common Criteria”...

Analysis
16th December 2009
German Research Project CoSiP Lays Foundation for Simultaneous Development of Chip, Package and PCB Board for System-in-Package Applications

The growing complexity of microelectronic systems makes it necessary to align and coordinate the development of chips, packages and boards at a very early stage, especially when it comes to system-in-package (SiP) applications.

First Previous Page 44 of 44 Next Last

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier