Bluetooth

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Next-gen Bluetooth module enables advanced wireless connectivity

Next-gen Bluetooth module enables advanced wireless connectivity
Featuring what the company claims to be the industry's lowest power Bluetooth Low Energy SoC, the next-gen Bluetooth module from Panasonic has been introduced. The PAN1760A module benefits from a peak power consumption of only 3.3mA in Tx and Rx mode, enabling advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life. Mandatory and optional Bluetooth 4.2 features are supported.
12th October 2017

Wireless SoC is Bluetooth 4.2-compliant, Bluetooth 5.0-certified

Wireless SoC is Bluetooth 4.2-compliant, Bluetooth 5.0-certified
The BlueNRG-2 system-on-chip (SoC) from STMicroelectronics (ST) is now being shipped by Mouser Electronics. The BlueNRG-2 SoC is a power-efficient programmable processor with ultra-low-power features, high RF signal strength, and generous on-chip memory for Bluetooth low energy software and application code.
4th October 2017

The challenge with today’s Bluetooth trackers

The challenge with today’s Bluetooth trackers
If you’ve ever lost your keys, wallet, or mobile phone, you probably know that terrible feeling that comes with losing something important. A mixture of fear, regret, and helplessness – most of us have experienced it and will do anything to prevent it from happening again. Guest blog by Florian Bousquet.
4th October 2017


Full-featured Bluetooth 5 module for smart city applications

Full-featured Bluetooth 5 module for smart city applications
Global provider of wireless and positioning modules and chips, u‑blox, has announced the launch of its full Bluetooth 5 compliant NINA-B3 wireless MCU module. Featuring Bluetooth low energy long range connectivity, high data transfer rates and supporting Bluetooth mesh and 802.15.4, NINA‑B3 caters to applications in smart buildings, smart cities, and the Industry 4.0, including smart lighting systems, industrial sensor networks, asset tracking solutions, and building automation systems.
3rd October 2017

BLE processor accelerates time-to-market for connected smart objects

BLE processor accelerates time-to-market for connected smart objects
To help product innovators streamline prototyping and development of connected smart objects, STMicroelectronics has created the SPBTLE-1S ready-to-use Bluetooth Low Energy (BLE) module that integrates all the components needed to complete the radio subsystem. The new BLE module integrates ST’s proven BlueNRG-1 application-processor System-on-Chip (SoC) and balun, high frequency oscillators, and a chip antenna.
25th September 2017

Bluetooth 5 module boasts increased flash memory

Bluetooth 5 module boasts increased flash memory
The SaBLE-x-R2 Bluetooth 5 module from Laird Technologiesis being shipped by Mouser Electronics. The module builds on the original field-proven hardware of the SaBLE-x module to accelerate the development time for implementing cutting-edge Bluetooth low energy connectivity in Internet of Things (IoT) sensors and beacons for commercial, medical, and industrial applications.
6th September 2017

Open CPU WiFi modules are Bluetooth 5 qualified

Open CPU WiFi modules are Bluetooth 5 qualified
Global provider of wireless and positioning modules and chips, u-blox, has announced enhancements to its series of NINA stand alone short range radio modules. NINA B1 Bluetooth low energy modules are now Bluetooth 5 qualified. And for the first time, the ultra-compact NINA-W101 and NINA-W102 WiFi and Bluetooth wireless modules give developers access to their microcontroller units (MCU), allowing them to run their own applications right in the module.
6th September 2017

Wi-Fi + Bluetooth 5 module provides unmatched connectivity

  Laird has introduced a new series of Wi-Fi and Bluetooth modules that provide unmatched connectivity, and improves network efficiency and spectrum use. The new modules also enable optimal mobile device performance in the most challenging wireless environments.
4th September 2017

Link Layer and PHY IP achieve Bluetooth 5 qualification

Synopsys has announced that the silicon-proven DesignWare Bluetooth Low Energy Link Layer IP and PHY IP in industry-standard 40-nm and 55-nm processes have achieved Bluetooth 5 qualification and have been declared compliant by the Bluetooth Special Interest Group. Achieving qualification ensures the robustness of the IP and that it functions as expected within a SoC.
4th September 2017

Bluetooth temperature demo using the ADICUP3029 and ADT7420

Watch this video to learn how to import and run the Bluetooth temperature demo example on the tools and visualise the data on the IoTNode smart app.
30th August 2017


Bluetooth documents


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Developing wearable products: technology and opportunities
17th January 2018
United Kingdom Cocoon Networks, London